A Stacked Sensor Concept for Industry Compatible Plasma Diagnostics

Christian Schulz, Bianca Will, Ilona Rolfes

International Conference on Electromagnetics in Advanced Applications (ICEAA), pp. 683-686, DOI: 10.1109/ICEAA.2014.6903945, Palm Beach, Aruba, Kingdom of the Netherlands, Aug 3 – 9, 2014


Abstract

This paper presents a stacked sensor concept, which is producible entirely on standard printed circuit boards and applicable for the control of industrial plasma processes. Starting with the so-called multipole resonance probe (MRP) the prospects and the development towards the stacked MRP (sMRP) are discussed. The conversion of the MRP into a discretized spherical setup, using printed half discs of varying radii, is investigated. 3D electromagnetic field simulations yield an optimized assembly of 25 PCBs for a replication of the probe head. Measurements of a first prototype in a double inductive coupled plasma with an excited argon-hydrogen plasma have proven the expected resonance behaviour. In comparison to the MRP and the simulations, the applicability of the stacked sensor concept is demonstrated.

[IEEE Library]

Tags: electromagnetic fields, plasma